Stateside Spec Engineering jobs in the United States

Shield AI

RF Engineer II (R6053)

Seattle, WA · On-site · Mid

Discipline
Electrical
Industry
Defense

Spec sheet

Automatically summarized from the employer’s posting. Check the original description below for full requirements.

X-BAT Division

RF Engineer II (R6053) seeks an RF and Microwave Hardware Design Engineer to design compact RF modules for airborne/ground systems, focusing on hands-on module design, active and passive RF circuits, PCB assemblies, and production transition; role can be Engineer II or Senior Engineer level depending on depth and impact.

Day shift

Required

  • RF design
  • Microwave hardware
  • PCB assemblies
  • lab verification
  • production transition
  • active RF circuits
  • passive RF circuits
  • RF module design

Preferred

  • Antenna design
  • EMC/EMI
  • RF packaging
  • S-parameter measurements
  • test automation
  • liason with manufacturing

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Employer description

Shield AI is a venture-backed defense-tech company with the mission of protecting service members and civilians with intelligent systems. Its products include Hivemind autonomy software, V-BAT and X-BAT aircraft, and Aechelon simulation and synthetic reality technologies. With offices and facilities across the U.S., Europe, the Middle East, and Asia-Pacific, Shield AI’s technology actively supports operations worldwide. For more information, visit www.shield.ai. Follow Shield AI on LinkedIn, X, Instagram, and YouTube. 

Job Description:
Shield AI develops intelligent autonomous systems that protect service members and civilians. The X-BAT Engineering team is building a next-generation autonomous aircraft for demanding and contested environments.
We are seeking an RF and Microwave Hardware Design Engineer to design and deliver compact, high-performance RF modules for airborne and ground systems. You will design and mature active and passive RF circuits, PCB assemblies, packaging interfaces, laboratory verification, and transition to production. The center of gravity of this position is hands-on module design rather than top-level communications architecture, waveform development, or link-budget ownership.
This position may be filled at the Engineer II (L2) or Senior Engineer (L3) level. The selected level will reflect the candidate’s demonstrated technical depth, independence, scope, and impact.

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