Spec sheet

Automatically summarized from the employer’s posting. Check the original description below for full requirements.

Mechanical Engineering

Electronics Packaging Engineer at Johns Hopkins APL in Laurel, MD leads electromechanical hardware design from concept through delivery, including thermal and structural analyses, detailed design, assembly, and testing. Requires a BS in mechanical/aerospace engineering, 5+ years in mechanical engineering, product development lifecycle, CAD/CAE proficiency, and ability to obtain a Secret clearance.

$100,000–$245,000 / year · Day shift · 5+ years · Bachelor's of Science in Mechanical Engineering, Aerospace Engineering or related discipline

Required

design of electromechanical hardware
thermal analysis
structural analysis
CAD and CAE software (CREO, SolidWorks, ANSYS, FEMAP)
full product development lifecycle
ability to obtain a Secret level security clearance
experience with design, analysis, and integration

Preferred

Master's Degree in Mechanical or Aerospace Engineering
military electromechanical packaging experience
NASA/MIL requirements familiarity

Benefits

medical
retirement contributions
PTO
education assistance

Employer description

Description

Do you love to design, analyze, and test mechanical hardware?

Do you have a fundamental drive and fascination for solving problems of all kinds?

Are you searching for impactful work in the area of electronics packaging and finite element analysis that does not confine you to working on the same thing year after year?

Does making meaningful contributions to projects, that span from submarines, surface ships, UAV ‘s, aircraft, ground vehicles, missiles, to spacecraft, sound like a dream job?

If so, we are looking for someone like you to join our team at the Johns Hopkins Applied Physics Laboratory (APL).

We are seeking an Electronics Packaging Engineer to help us develop mechanical systems. As a member of the Concept Design & Realization Branch, you will be working with teams of passionate engineers and scientists who design, analyze, and test systems for all of APLs Mission Areas. Our team strives to deliver robust mechanical solutions to APLs most difficult problems. Our team values leadership and communication skills and we cultivate an environment of collaboration.

Your primary responsibility will be to lead the design effort of electromechanical hardware from concept thru delivery, including thermal and structural analysis, detailed design, assembly, and testing.

As an Electronics Packaging Engineer you will…

Work in a fast-paced environment requiring innovative solutions to difficult technical challenges.Promote engineering standard methodologies and work on state of the art hardware.Work with other engineers and scientists on unique research and development efforts.Participate in design reviews and team meetings.Mentor junior members of the team.
Qualifications

You meet our minimum qualifications for the job if you have…

Bachelor’s of Science in Mechanical Engineering, Aerospace Engineering or related discipline.5+ years of experience in mechanical engineering.Experience with full product development lifecycle, including design, structural/thermal analysis, and integration.Familiarity with CAD and CAE software (CREO, SolidWorks, ANSYS, FEMAP, etc).A proven ability to work closely with engineering teams to develop systems.High initiative, motivation, flexibility, and interest in working in a fast-paced team environment.Good communications and team building skills.Occasional travel to government and contractor facilities as required.Occasional work in secure facilities.Are able to obtain a Secret level security clearance. If selected, you will be subject to a government security clearance investigation and must meet the requirements for access to classified information. Eligibility requirements include U.S. citizenship.

You ‘ll go above and beyond our minimum requirements if you have…

Master’s Degree Mechanical Engineering, Aerospace Engineering or related discipline.Prior experience designing, analyzing, and qualifying electromechanical systems for military applications.Hands on experience with thermal and structural analysis.Completed several mechanical packaging projects from start to finish.Demonstrated the ability to work closely with engineering teams in all phases of the design, analysis, assembly, andtesting process.Familiarity with NASA and MIL requirements.

About Us

Why Work at APL?

The Johns Hopkins University Applied Physics Laboratory (APL) brings world-class expertise to our nation’s most critical defense, security, space and science challenges. While we are dedicated to solving complex challenges and pioneering new technologies, what makes us truly outstanding is our culture. We offer a vibrant, welcoming atmosphere where you can bring your authentic self to work, continue to grow, and build strong connections with inspiring teammates.

At APL, we celebrate our differences of perspectives and encourage creativity and bold, new ideas. Our employees enjoy generous benefits, including a robust education assistance program, unparalleled retirement contributions, and a healthy work/life balance. APL’s campus is located in the Baltimore-Washington metro area. Learn more about our career opportunities at https://www.jhuapl.edu/careers.

All qualified applicants will receive consideration for employment without regard to race, creed, color, religion, sex, gender identity or expression, sexual orientation, national origin, age, physical or mental disability, genetic information, veteran status, occupation, marital or familial status, political opinion, personal appearance, or any other characteristic protected by applicable law. APL is committed to providing reasonable accommodation to individuals of all abilities, including those with disabilities. If you require a reasonable accommodation to participate in any part of the hiring process, please contact [email protected].

The referenced pay range is based on JHU APL’s good faith belief at the time of posting. Actual compensation may vary based on factors such as geographic location, work experience, market conditions, education/training and skill level with consideration for internal parity. For salaried employees scheduled to work less than 40 hours per week, annual salary will be prorated based on the number of hours worked. APL may offer bonuses or other forms of compensation per internal policy and/or contractual designation. Additional compensation may be provided in the form of a sign-on bonus, relocation benefits, locality allowance or discretionary payments for exceptional performance. APL provides eligible staff with a comprehensive benefits package including retirement plans, paid time off, medical, dental, vision, life insurance, short-term disability, long-term disability, flexible spending accounts, education assistance, and training and development. Applications are accepted on a rolling basis.

Minimum Rate

$100,000 Annually

Maximum Rate

$245,000 Annually
Do you love to design, analyze, and test mechanical hardware?

Do you have a fundamental drive and fascination for solving problems of all kinds?

Are you searching for impactful work in the area of electronics packaging and finite element analysis that does not confine you to working on the same thing year after year?

Does making meaningful contributions to projects, that span from submarines, surface ships, UAV ‘s, aircraft, ground vehicles, missiles, to spacecraft, sound like a dream job?

If so, we are looking for someone like you to join our team at the Johns Hopkins Applied Physics Laboratory (APL).

We are seeking an Electronics Packaging Engineer to help us develop mechanical systems. As a member of the Concept Design & Realization Branch, you will be working with teams of passionate engineers and scientists who design, analyze, and test systems for all of APLs Mission Areas. Our team strives to deliver robust mechanical solutions to APLs most difficult problems. Our team values leadership and communication skills and we cultivate an environment of collaboration.

Your primary responsibility will be to lead the design effort of electromechanical hardware from concept thru delivery, including thermal and structural analysis, detailed design, assembly, and testing.

As an Electronics Packaging Engineer you will…

Work in a fast-paced environment requiring innovative solutions to difficult technical challenges.Promote engineering standard methodologies and work on state of the art hardware.Work with other engineers and scientists on unique research and development efforts.Participate in design reviews and team meetings.Mentor junior members of the team.
You meet our minimum qualifications for the job if you have…

Bachelor’s of Science in Mechanical Engineering, Aerospace Engineering or related discipline.5+ years of experience in mechanical engineering.Experience with full product development lifecycle, including design, structural/thermal analysis, and integration.Familiarity with CAD and CAE software (CREO, SolidWorks, ANSYS, FEMAP, etc).A proven ability to work closely with engineering teams to develop systems.High initiative, motivation, flexibility, and interest in working in a fast-paced team environment.Good communications and team building skills.Occasional travel to government and contractor facilities as required.Occasional work in secure facilities.Are able to obtain a Secret level security clearance. If selected, you will be subject to a government security clearance investigation and must meet the requirements for access to classified information. Eligibility requirements include U.S. citizenship.

You ‘ll go above and beyond our minimum requirements if you have…

Master’s Degree Mechanical Engineering, Aerospace Engineering or related discipline.Prior experience designing, analyzing, and qualifying electromechanical systems for military applications.Hands on experience with thermal and structural analysis.Completed several mechanical packaging projects from start to finish.Demonstrated the ability to work closely with engineering teams in all phases of the design, analysis, assembly, andtesting process.Familiarity with NASA and MIL requirements.