Micron
Process Integration Engineer, APTD
Boise, ID · On-site · Mid
- Discipline
- Hardware
- Industry
- Semiconductor
Spec sheet
Automatically summarized from the employer’s posting. Check the original description below for full requirements.
APTD (Advanced Packaging Technology Development)
Process Integration Engineer at Micron in Boise, ID leads semiconductor process integration projects and collaborates across engineering teams to optimize flow, yield, and reliability for memory technologies. Requires 4+ years in semiconductor process integration or related fields and a degree in engineering or physics; experience with data-driven methods and JMP is preferred.
4+ years · Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or related field
Required
- process integration
- process development
- device development
- DoE
- statistical analysis
- root-cause investigation
- AI/ML tools (preferred)
Preferred
- advanced packaging technologies
- 2.5D/3D integration
- TSV
- yield analyses
- statistical models
- AI/machine learning in engineering workflows
Benefits
- medical
- PTO
- paid holidays
- dental
- vision
- Paid family leave
Employer description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Department Intro:
The Advanced Packaging Technology Development (APTD) team is developing the packaging and integration technologies that will power future generations of memory products. We bring together engineers, scientists, and innovators who thrive on solving complex technical challenges and turning breakthrough ideas into scalable manufacturing solutions. Working across device engineering, package design, reliability, and manufacturing, we help shape the future of High Bandwidth Memory (HBM) and advanced memory technologies.
Position Overview:
As a Process Integration Engineer, you will play a key role in developing and integrating advanced semiconductor process flows that enable next-generation memory solutions. This position offers the opportunity to lead challenging technical programs, solve complex integration issues, and influence technology decisions from concept through manufacturing transfer. You will work closely with cross-functional teams, use data-driven approaches to guide decisions, and help deliver innovative technologies that balance performance, yield, reliability, manufacturability, and cost.
Responsibilities:
Lead process integration projects supporting new technology development programsPartner with process development, device engineering, package design, product engineering, reliability, and manufacturing teams to solve integration challengesUse AI-enabled tools, statistical analysis, and engineering data to accelerate problem solving and decision-makingDesign, implement, and analyze experiments to improve process performance, yield, variability, and reliabilityIdentify yield limiters and root causes through analysis of metrology, defect, parametric, probe, reliability, and test dataDrive corrective actions from root cause identification through implementation and validationDevelop and improve integration flows that balance performance, manufacturability, quality, reliability, cost, and schedule requirementsSupport technology qualification, manufacturing transfer, and development activities across multiple sites
Minimum Qualifications:
Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field with 4+ years of semiconductor industry experience; OR Master’s degree with 2+ years of semiconductor experience; OR PhD in a related fieldExperience in process integration, process development, or device development, including experiment design, execution, and analysisKnowledge of semiconductor process integration and memory technologies such as DRAM, NAND, or emerging memory architecturesExperience using JMP or similar statistical analysis tools to drive engineering decisionsDemonstrated ability to solve complex technical problems using data-driven methods, statistical analysis, DoE, and root-cause investigation
Preferred Qualifications:
Experience with advanced packaging technologies such as wafer-level packaging, fan-out packaging, 2.5D/3D integration, TSV, bonding, or chiplet integrationExperience supporting technology development, qualification, and transfer into high-volume manufacturingExperience using yield, reliability, electrical, or process data to identify challenges and guide technical decisionsExperience developing statistical models, correlation studies, and yield analyses to drive process improvementsExperience applying AI or machine learning tools to engineering workflows, analytics, and yield improvement initiatives
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate’s true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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