Stateside Spec Engineering jobs in the United States

Intel

Module Equipment Development Engineer

Hillsboro, OR · On-site · Mid

Discipline
Hardware
Industry
Semiconductor

Spec sheet

Automatically summarized from the employer’s posting. Check the original description below for full requirements.

Intel Foundry Technology Development

Module Equipment Development Engineer at Intel in Hillsboro, OR, develops equipment and processes for advanced semiconductor manufacturing. The role requires degrees in STEM and 3–6+ years in semiconductor processing, plus experience with lithography, etching, and thin films; candidates should be proficient in statistical analysis and materials characterization.

$115,110–$219,550 / year · Day shift · Equity · 4+ years · Bachelor's degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field

Required

  • semiconductor processing
  • lithography
  • etching
  • thin film deposition
  • planarization
  • statistical analysis tools (JMP, MATLAB, Python)
  • materials characterization techniques (SEM, TEM, XPS, ellipsometry)

Preferred

  • equipment troubleshooting
  • maintenance or development with suppliers
  • experience at a semiconductor tool supplier
  • vacuum processes, ALD, or CVD
  • cross-functional collaboration

Benefits

  • medical
  • retirement
  • vacation
  • stock bonuses

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Employer description

Job Details:

Job Description: The Role and Impact:
As a Module Equipment Development Engineer, you will lead the development and optimization of advanced semiconductor manufacturing equipment and processes, enabling Intel to deliver high-performance devices. Your contributions will directly impact Intel’s technological leadership in the semiconductor industry and advance the capabilities of future technologies.

Business Group:
Intel Foundry Technology Development is focused on advancing semiconductor process engineering and delivering world-class manufacturing solutions that power Intel’s product innovation. Working within this group, you will collaborate with global teams to develop cutting-edge technologies that enable the design and production of leading-edge devices, helping Intel maintain its leadership in a competitive and fast-paced market.

Key Responsibilities:

Develop Equipment capable of delivering on new process requirements in Dielectrics Thin Films.Develop robust Equipment modules that can be transferred seamlessly to high volume manufacturing.Collaborate with equipment and material suppliers to evaluate, qualify, and implement novel technologies into manufacturing processesSupport technology transfer to high-volume manufacturing through training, audits, and maintaining process consistency across sitesDesign, execute, and analyze experiments to optimize advanced manufacturing processes, including material selection, equipment metrology, and parameter tuningPerform feasibility studies and pathfinding activities to support innovative device architectures and future technology roadmapsUtilize advanced data analysis methods, including Statistical Process Control (SPC) and Design of Experiments (DOE), to guide process improvements and enhance yieldPartner with cross-functional teams to ensure seamless process integration and manufacturability

Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

 

Minimum Qualifications:

Bachelor’s degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related STEM field, with 4+ years of industry experience in semiconductor processingOR

Master’s degree in relevant STEM fields with 3+ years of domain-specific experienceOR

PhD in Materials Science, Chemical Engineering, Physics, Chemistry, or related STEM field with 6+ months experience in semiconductor processing
Industry experience in semiconductor processing/domain-specific experience includes one of more of the following:

Proficiency in semiconductor processing techniques such as lithography, etching, thin film deposition, or planarizationExpertise in process characterization methods and statistical analysis tools, such as JMP, MATLAB, or PythonFamiliarity with materials characterization techniques like SEM, TEM, XPS, or ellipsometry
Preferred Qualifications:

Hands-on experience working with equipment troubleshooting, maintenance, or development in collaboration with suppliersExperience at a Semiconductor manufacturing tool supplier.Knowledge of manufacturing technologies including vacuum processes, ALD, or CVDStrong problem-solving skills with the ability to manage multiple tasks in a fast-paced environmentCollaborative mindset with a proven track record of working across interdisciplinary teams to achieve shared goals
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

          

Job Type:Experienced Hire

Shift:Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. 

 

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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